Products
Contact Us
- Contact Person : Ms. wu ren
- Company Name : Yixing City Jitai Electronics Co., Ltd.
- Tel : 0086-0510-87186095
- Fax : 0086-0510-87188298
- Address : Jiangsu,Yixing,Jiangsu Province Yixing City Dingshu Town
- Country/Region : China
- Zip : 214221
Products List
photoelectron package
photoelectron package
material:base 4J29
cover 4J42
photoelectron packagematerial:base 4J29 cover 4J42plating:Ni 2.54-8.9um, Au:...
CIRCULAR METAL PACKAGE FOR HIC
Circular metal package
Material:4J29(FeNiCo) alloy/WCu alloy.
Surface plating:Ni/Au plating,selective Au plating.
Circular metal packageApplication areas:All kinds monolithic integrated circuit\hybrid integrated circuits package and also applied in microwave devices,suitable for...
Hybrid package
Hybrid package
material:base 4J29
cover 4J42
Hybrid packagematerial:base 4J29 cover 4J42plating:Ni≥ 2-8um , Au≥0.3um
...
High-power component
High-power component
material:base 10#steel
cover 4J42
feedthru
High-power componentmaterial:base 10#steel cover...
Can-flat form Metal Package
Can-flat form Metal Package
Material:4J29(FeNiCo) alloy/WCu alloy.
Surface plating:Ni/Au plating,selective Au plating.
Can-flat form Metal PackageApplication areas:All kinds monolithic integrated circuit\hybrid integrated circuits package and also applied in microwave...
Butterfly Package
Butterfly Package
Application areas:
Monolithic integrated circuit
Hybrid integrated circuits package
Microwave devices.
Butterfly PackageGeneral information:1.Application areas:All kinds monolithic integrated circuit\hybrid integrated circuits package and also applied in...
Hermetic housings
Hermetic housings Application areas:
1.Hybrid thick flim.Plug-in assembly
2.Thin-flim integrated circuits package
Hermetic housings Specifications:1.Application areas:All kinds of hybrid thick flim and thin-flim integrated circuits package,suitable for plug-in...
Metal Package for HIC
Metal Package for HIC
Material:4J29(FeNiCo) alloy.
Surface plating:selective Au plating.
Metal Package for HICApplication areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly.Material:4J29(FeNiCo) alloy.Surface...
Metal packaging
Metal packaging
Material:4J29(FeNiCo) alloy.
Surface plating:Ni/Au plating,selective Au plating.
Metal packagingApplication areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly.Material:4J29(FeNiCo) alloy.Surface...
Uni-Body Packages
Hermetic housings
Material:4J29(FeNiCo) alloy.
Surface plating:Ni/Au plating,selective Au plating.
Hermetic housingsApplication areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly.Material:4J29(FeNiCo) alloy.Surface...