Butterfly Package

Butterfly Package Application areas: Monolithic integrated circuit Hybrid integrated circuits package Microwave devices.

Butterfly Package

General information:

1.Application areas:All kinds monolithic integrated circuit\hybrid integrated circuits package and also applied in microwave devices,suitable for labeing and marking on the surface.

2.Material:4J29(FeNiCo) alloy/WCu alloy.3.Surface plating:Ni/Au plating,selective Au plating.

4.Technical requirement: All of the property index conform to the requirements of GJB2440A<<Gen-

eral Standard of Hybrid Integrated Circuit Package>>.

5.High Frequency Design,ideal for speed devices.

6.Enhanced thermal conductivity,ideal for TEC installation.

Typical requirement:

1.Au plating thickness ≥0.7µm;Ni plating thickness is between 1.3-11.43µm.

(We can also according to the requirements of customer)

2.No blisters on Au after 3 minutes at 350 deg-celcius(in air)as seen under 10x magnification.

3.Isolation resistance>10 MEG OHMS at 100V DC.

4.RoHS compliant.

5.No cracks,peeling,flaking,blister,burrs,stains,spots,contamination.

  

Butterfly Package