Products
Contact Us
- Contact Person : Ms. wu ren
- Company Name : Yixing City Jitai Electronics Co., Ltd.
- Tel : 0086-0510-87186095
- Fax : 0086-0510-87188298
- Address : Jiangsu,Yixing,Jiangsu Province Yixing City Dingshu Town
- Country/Region : China
- Zip : 214221
Other Electronic Accessories
Hermetic housings
Hermetic housings Application areas:
1.Hybrid thick flim.Plug-in assembly
2.Thin-flim integrated circuits package
Hermetic housings Specifications:1.Application areas:All kinds of hybrid thick flim and thin-flim integrated circuits package,suitable for plug-in...
Metal Package for HIC
Metal Package for HIC
Material:4J29(FeNiCo) alloy.
Surface plating:selective Au plating.
Metal Package for HICApplication areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly.Material:4J29(FeNiCo) alloy.Surface...
Glass-to-metal sealing
Glass-to-metal sealing
Material:4J29(FeNiCo) alloy.
Surface plating:Ni/Au plating,selective Au plating.
Glass-to-metal sealingApplication areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly.Material:4J29(FeNiCo) ...
Metal packaging
Metal packaging
Material:4J29(FeNiCo) alloy.
Surface plating:Ni/Au plating,selective Au plating.
Metal packagingApplication areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly.Material:4J29(FeNiCo) alloy.Surface...
Uni-Body Packages
Hermetic housings
Material:4J29(FeNiCo) alloy.
Surface plating:Ni/Au plating,selective Au plating.
Hermetic housingsApplication areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly.Material:4J29(FeNiCo) alloy.Surface...
Metal Package
Metal Package
Material:4J29(FeNiCo) alloy.
Surface plating:Ni/Au plating,selective Au plating.
Metal PackageApplication areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly.Material:4J29(FeNiCo) alloy.Surface...
Hybrid package
Hybrid package Application areas:
1.Hybrid thick flim.Plug-in assembly
2.Thin-flim integrated circuits package
Hybrid package Specifications:1.Application areas:All kinds of hybrid thick flim and thin-flim integrated circuits package,suitable for plug-in...
Platform Packages
Platform Packages
Material:4J29(FeNiCo) alloy.
Surface plating:Ni/Au plating,selective Au plating.
Platform Packages Application areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly.Material:4J29(FeNiCo) ...
Hermetic housings
Hermetic housings
Material:4J29(FeNiCo) alloy.
Surface plating:Ni/Au plating,selective Au plating.
Hermetic housingsApplication areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly.Material:4J29(FeNiCo) alloy.Surface...
Electronic packaging
Electronic packaging
Material:4J29(FeNiCo) alloy.
Surface plating:Ni/Au plating,selective Au plating.
Electronic packagingApplication areas:All kinds hybrid thick flim and thin-flim integrated circuits package ,suitable for plug-in assembly.Material:4J29(FeNiCo) ...
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